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Products
Computer-on-modules
 CM-X300
 CM-X270
 CM-iGLX
 CM-iPM
 CM-X255
Handheld computers
 EM-X270
Single board computers
 SBC-X300
 SBC-X270
 SBC-iGLX
 ATX
 SBC-X255
Ready-to-use products
 ENC-iGLX

Related Topics:
 - CoM Comparison
 - PC/104 Comparison
 - Evaluation Kits
 - Industrial Temperature
 - RoHS Compliance
 - Life Cycle

 

 

 CM-iPM Computer-On-Module                

Top View

Bottom View

with Heatsink
CM-iPM Highlights

  • Full-featured high performance embedded PC on module

  • Intel Pentium-M CPU, up to 2 GHz.

  • PCI, PCI Express, LPC and AC97 buses

  • Up to 1024 Mbyte DDR2 RAM

  • Up to 512 Mbyte Flash Disk

  • UXGA graphics controller with LCD, LVDS, CRT and TV interfaces
    see LCD panel support

  • Up to 6 USB-2 ports

  • IDE and SATA HDD interfaces

  • UART, GPIO's, PS/2 keyboard and mouse ports

  • 100Mb and 1000Mb Ethernet ports

  • Sound I/O

  • Embedded BIOS

  • Small size - 70 x 90 mm 

  • Interchangeable with other CoM's via CAMI connectors

  • Mini-ATX baseboard for evaluation and development

 The CM-iPM module is a small and extremely powerful PC-compatible CoM (Computer-on-Module), designed to serve as a building block in a variety of embedded applications. The CM-iPM has all the components needed to run operating systems such as Windows  XP or Linux. Ready BIOS and operating system packages are available from CompuLab.

The CM-iPM is both small and inexpensive relative to products of its class, which allows its integration into compact applications requiring both embedded and multimedia feature sets.

The feature set of the CM-iPM module includes practically all of the components found in a high-end desktop computer. For embedded applications, the CM-iPM provides a Flash Disk, PCI bus, 100/1000Mbit Ethernet ports, UART, I/O lines and many other essential functions. 

For more information see:

Operating System Support
Developer Resources
 Reference Guide


Block Diagram

 

CM-iPM Features

The "option" column lists the configuration code for specifying the particular feature's value. 
"+" means that the feature is always available.

CPU & Core logic

Feature Specifications Option
CPU Celeron-M or Pentium-M, from 1.0 to 2.0 GHz C/P
Core Logic DMA and  Interrupt controllers, Timers +

Memory and Busses

Feature Specifications Option
DRAM 256 - 1024 MB DDR-2, 400 MHz, Dual channel 64-bit D
BIOS Flash 1/2 Mbyte, on-board reprogrammable +
NAND Flash Disk 128 - 512 Mbytes N
External Busses PCI, PCI Express, LPC, AC97 rev 2.3 / Intel High Definition Audio +
PCI bus 32-bit, 33 MHz, rev  2.2-compliant, 3.3V-levels 5V-tolerant
Arbiter and clock for 4 masters		 +
LPC bus Host, 33 MHz, Intel LPC v1.0 compatible +

Peripherals

Feature Specifications Option
Graphics Controller Resolution up to 1920 x 1200, frame buffer in system memory, 2D/3D hardware accelerator +
Display Interface LCD - 18-bit TFT (parallel RGB)
CRT - 24-bit resolution (analog RGB), 250 MHz RAMDAC
TV - composite video, PAL / NTSC
LVDS - single or dual channel, including 3-pair modes support		 +
+
+
+
USB 4 or 6 Host USB 2.0 ports, 480 Mbps, EHCI / UHCI compliant +
UART One serial port, including flow control

+
General Purpose I/O 20 lines, shared with other functions. 3.3V-levels, 5V- tolerant +
Hard Disk Interface (1) U-DMA 100/66/33, BMIDE and PIO modes. (2) Serial ATA +
Keyboard & Mouse PS/2 or USB. Console can also be redirected from serial port +
Ethernet Two ports, including MAC & PHY, 10/100/1000BaseT, LED's.  
1st port - 10/100 Mb/s
2nd port - 10/100/1000 Mb/s
E1
E2
Audio codec Realtek ALC260 codec, Intel HDA interface (Azalia), mono microphone input, stereo line input and line output for active speakers A
RTC Real Time Clock, powered by external lithium battery +

Electrical, Mechanical and Environmental Specifications

Supply Voltage 3.3V and  5.0V
Power consumption 10 - 30 watt, depending on application and CPU speed
Dimensions 70 x 90 mm. Height: - TBD, depending on heatsink type.
Weight 60 gram w/o heatsink, 130 gram with heatsink
MTBF > 100,000 hours
Operation temperature
(on heatsink)

 
Commercial:    0o to 70o C
Extended: -20o to 70o C
Industrial: -40o to 85o C. Click for availability note

Note: user must ensure that the heatsink temperature will not exceed the allowed maximum.  Heatsink should be cooled by airflow. 
Storage temperature -40o to 85o C
Relative humidity 10% to 90% (operation)
05% to 95% (storage)
Shock 50G / 20 ms
Vibration 20G / 0 - 600 Hz
Connectors 3 x 140 pin, 0.6 mm. Insertion / removal - 50 cycles

For more information see:
- CM-iPM Reference Guide
- Developer Resources

 

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