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 CM-X300
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 CM-iGLX
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 CM-X255
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 EM-X270
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 SBC-X300
 SBC-X270
 SBC-iGLX
 ATX
 SBC-X255
Ready-to-use products
 ENC-iGLX

Related Topics:

 - CoM Comparison
 - PC/104 Comparison
 - Evaluation Kits
 - Industrial Temperature
 - RoHS Compliance
 - Life Cycle

 

 

 Industrial Temperature Support     

Manufacturers of VLSI components are usually don't rate them for -40°  to +85° C range, mainly because market demand is low. Certification tests are therefore performed by CompuLab.  Most of tested components are found compatible, while component types showing temperature sensitivity are replaced by non-sensitive counterparts. 

Small components, such as capacitors, resistors, oscillators, as well as small integrated circuits used in CompuLab's boards are usually rated by manufacturers for wide temperature range.

The cards' testing method depends on the selected temperature range:

Range

Temp*

Description

Commercial

0o to 70o C

Sample cards from each batch are tested at the lower and upper temperature limits. Individual cards are not tested for temperature compliance.

Extended

-20o to 70o C

Every card undergoes powerup and short built-in test for the lower limit (-20o C) qualification.
Extended temperature certification is available for all card's configurations.

Industrial

-40o to 85o C

Using dedicated test suit, every card is extensively tested at lower and upper temperature limits and at several midpoints. Most of on-board peripherals are covered by the test.
Industrial temperature certification is available only for card's in the same configuration as kept in stock.

Temperature as measured on the hottest spot of the card or heatsink (if it has one)

Test Coverage

The test is performed under Linux operating system. Tested features:

  • CPU
  • SDRAM
  • Flash Disk
  • Serial Port(s)
  • Graphics controller
  • Ethernet
  • CardBus and PCMCIA, with ATA card
  • USB
  • Sound

* Tested features can vary according to card's type.

Industrial Temp Certification Procedure

  • Programming the card with industrial temp test suit.
  • Cooling without power, at least 20 min while test chamber is set to -48° C.
  • Power up / power down test, 10 cycles.
  • Testing of listed above features, using dedicated test suit.
  • Drying the card.
  • Heat up to maximum temperature limit.
  • Power up / power down test, 10 cycles, on upper temperature limit.
  • Testing of listed above features, using dedicated test suit.
  • Reprogramming the card in functional tester back to standard contents.
  • Running functional ATP at room temperature.

 

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